XFX Radeon RX 550 4GB Low Profile
vs
INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss


GPU comparison with benchmarks

The XFX Radeon RX 550 4GB Low Profile has 512 shader units and these clock a maximum of 1.20 GHz which results in an FP32 computing power of 1.23 TFLOPS.

The INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss has 1664 shader units and these clock at a maximum of 1.25 GHz and achieve an FP32 computing power of 4.17 TFLOPS.

GPU

The XFX Radeon RX 550 4GB Low Profile is equipped with a graphics chip of the GCN 4 architecture, which has 8 streaming multiprocessors.

The graphics card INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss is based on the Maxwell 2.0 architecture and is equipped with 13 execution units.
XFX Radeon RX 550 4GB Low Profile GPU INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss
AMD Radeon RX 550 (Lexa) Based on NVIDIA GeForce GTX 970
Lexa PRO GPU Chip GM204-200-A1
GCN 4 Architecture Maxwell 2.0
8 Streaming Multiprocessors 13
512 Shader 1664
16 Render Output Units 56
32 Texture Units 104
0 Raytracing Cores 0

Memory

The XFX Radeon RX 550 4GB Low Profile is equipped with a 4 GB large GDDR5 graphics memory, which is equipped with 1.750 GHz clocks.

The INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss has a 4 GB large GDDR5 graphics memory and the memory clock is 1.800GHz.

4 GB Memory Size 4 GB
GDDR5 Memory Type GDDR5
1.750 GHz Memory Clock 1.800 GHz
7.0 Gbps Memory Speed 7.2 Gbps
112 GB/s Memory bandwidth 230 GB/s
128 bit Memory Interface 256 bit

Clock Speeds

The XFX Radeon RX 550 4GB Low Profile has a turbo clock of 1.203 GHz. The turbo frequency of the INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss is 1.253 GHz.

1.100 GHz Base Clock 1.160 GHz
1.203 GHz Boost Clock 1.253 GHz
Avg (Game) Clock
Yes Overclocking Yes

Thermal Design

The XFX Radeon RX 550 4GB Low Profile has connectors through which it is supplied with power. The manufacturer specifies the maximum operating temperature of the graphics card as 80 °C.

The INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss is equipped with a 2 x 6-Pin PCIe power connector that supplies it with power. The maximum operating temperature of the card is 98 °C.

50 W TDP 145 W
-- TDP (up) --
80 °C Tjunction max 98 °C
PCIe-Power 2 x 6-Pin

Cooler & Fans

The graphics processor and graphics memory of the XFX Radeon RX 550 4GB Low Profile are cooled with a Air cooling.

The INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss is cooled by a Air cooling.

Axial Fan-Type Axial
1 x 45 mm Fan 1 3 x 90 mm
-- Fan 2 1 x 45 mm
Air cooling Cooler-Type Air cooling
dB Noise (Idle) 0 dB
-- Noise (Load) --

Connectivity

The XFX Radeon RX 550 4GB Low Profile supports the downward compatible copy protection HDCP in version 2.2.

The INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss supports HDCP in version 2.2 and all previous versions.

4 Max. Displays 4
2.2 HDCP-Version 2.2
1x HDMI v2.0b HDMI Ports 1x HDMI v2.0
1x DP v1.4 DP Ports 3x DP v1.2
1 DVI Ports 1
-- VGA Ports --
-- USB-C Ports --

Featureset

The XFX Radeon RX 550 4GB Low Profile supports the DirectX standard from Microsoft in version 12.

The INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss supports Microsoft's DirectX version 12_1.

5120x2880 Max. resolution 4096x2160
12 DirectX 12_1
No Raytracing No
Yes DLSS / FSR No
No LED lighting LED Addressable LED

Supported Video Codecs

This area lists which video codecs can be decoded or encoded by the graphics cards in hardware. As a result, the power consumption can be reduced due to a lower processor load.

Decode / Encode h264 Decode / Encode
Decode / Encode h265 / HEVC No
No AV1 No
Decode VP8 Decode
Decode VP9 No

Dimensions

The XFX Radeon RX 550 4GB Low Profile is 40 mm wide and therefore needs the space of 3 PCIe-Slots in the case.

The width of the INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss is 40 mm and thus requires the space of 3 PCIe-Slots in the PC case.

178 mm Length 300 mm
121 mm Height 115 mm
40 mm Width --
2 PCIe-Slots Width (Slots) 3 PCIe-Slots
-- Weight --
PCIe 3.0 x 8 GPU Interface PCIe 3 x 16

Additional data

Manufactured using the 14 nanometer process, XFX Radeon RX 550 4GB Low Profile was released in Q4/2017.

The INNO3D GeForce GTX 970 iCHILL HerculeZ X4 Air Boss published in Q3/2014 is manufactured with a structure width of 28 nanometers.

RX-550P4LFG5 Part-no C97V-1SDN-M5DNX
Q4/2017 Release date Q3/2014
79 $ Launch Price 349 $
14 nm Structure size 28 nm
data sheet Documents --

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Benchmark results

3DMark Benchmark (DirectX, Raytracing)

3DMark is a benchmark program that determines the performance of certain components of a computer and then reports the performance as a numerical value.

Time Spy Extreme Graphics score

Battlefield 5

Battlefield 5 is a visually stunning game that is ideal as a graphics card benchmark. We test the game with maximum details on Windows 10.

3840x2160 (2160p)

2560x1440 (1440p)

XFX Radeon RX 550 4GB Low Profile XFX Radeon RX 550 4GB Low Profile
4 GB GDDR5
16 fps (avg)

1920x1080 (1080p)

XFX Radeon RX 550 4GB Low Profile XFX Radeon RX 550 4GB Low Profile
4 GB GDDR5
23 fps (avg)

Geekbench 6 (OpenCL, Vulkan, Metal)

Geekbench 6 is a cross-platform benchmark for main processors, which also carries out 3 different graphics benchmarks and outputs them in the form of a numerical value.

Geekbench 6 - OpenCL

Geekbench 6 - Vulkan

Geekbench 6 - Metal

FP32 Performance (Single-precision TFLOPS)

The theoretical computing power of the graphics card with single precision (32 bit) in TFLOPS indicates how many trillion FP32 floating point operations the graphics card (GPU) can perform per second.

FP32 (TFLOPS)

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